German chip plant breaks ground in ‘major step forward’ for EU’s semiconductor industry

Germany’s Infineon has broken ground on its new €5bn semiconductor manufacturing plant in Dresden, less than six months since announcing the project.  Speaking at the groundbreaking ceremony yesterday, European Commission President Ursula von der Leyen hailed the construction as a “major step forward” toward the bloc’s goal of boosting its market share in semiconductors. Europe is currently scrambling to reduce its reliance on foreign imports of semiconductor chips from, among others, China, Taiwan, and South Korea. “These are regions where tensions can flare up at any time,” said von der Leyen, in a nod to the current tensions between Beijing…

This story continues at The Next Web

Related Posts